Light emitting device

ABSTRACT

A light emitting device includes a first substrate including a flexible first base member and a first wiring pattern provided on the first base member; a second substrate including a second base member and a second wiring pattern provided on the second base member; and a plurality of light emitting elements mounted on the first wiring pattern. The first substrate includes: a joining end portion that is located at a first, joining end of the first substrate, and that overlaps a portion of the second substrate, and a second end, other than the joining end, that does not overlap the second substrate. The first wiring pattern and the second wiring pattern do not face each other. An electrically conductive joining member is disposed across the first wiring pattern and the second wiring pattern, while partially covering the joining end portion of the first substrate.

CROSS-REFERENCE TO RELATED PATENT APPLICATIONS

The present application is a continuation of U.S. application Ser. No.15/054,697, filed Feb. 26, 2016, which claims priority to Japan PatentApplication Nos. 2015-038647 filed on Feb. 27, 2015, and 2016-31223filed on Feb. 22, 2016, the contents of which are incorporated herein byreference in their entireties.

BACKGROUND

The present disclosure relates to a light emitting device.

Conventionally, a joining component such as a connector is used injoining substrates to each other. For example, JP 2013-016325 Adiscloses a structure of connecting a plurality of LED substrates and arelay substrate to each other via connectors. WO 2014/115344 discloses astructure in which a base substrate and a relay substrate are connectedto each other via connectors and solder. JP 2014-123688 A discloses alight emitting device in which a substrate where a light emittingelement is disposed is connected to another substrate by a connectionmember such as solder.

However, as disclosed in JP 2013-016325 A and WO 2014/115344, in aconfiguration in which connectors are used for joining substrates toeach other, with an increase in the number of portions of the substratesto join, the number of connectors increases, which increasesmanufacturing cost. Also, a large area is required for disposing theconnectors, which decreases the degree of freedom in arrangement of thesubstrates.

SUMMARY

Accordingly, an object of certain embodiments of the present inventionis to provide a light emitting device in which a flexible substrate andanother substrate can be connected to each other without using a joiningcomponent such as a connector, and thus a reduction in the manufacturingcost can be achieved. In the present disclosure, a configuration thatallows connecting a flexible substrate and another substrate withoutusing a joining component may be referred to as a substrate joiningstructure.

A light emitting device according to certain embodiments of the presentdisclosure includes a substrate joining structure having a firstsubstrate that includes a flexible first base member and a first wiringpattern provided on the first flexible base member, a second substratethat includes a second base member and a second wiring pattern providedon the second base member, and light emitting elements mounted on thefirst wiring pattern. A first end of the first substrate overlaps aportion of the second substrate while avoiding the first wiring patternand the second wiring pattern facing to each other, and a second end ofthe first substrate does not overlap the second substrate, and anelectrically conductive joining member is disposed at positions acrossthe first wiring pattern and the second wiring pattern while covering aportion of the first wiring pattern.

With the light emitting device according to certain embodiments of thepresent disclosure, a flexible substrate and other substrate can beconnected to each other without using joining components such asconnectors, and hence the costs associated to the connectors can bereduced. Further, the need of the area for disposing the connectors canbe eliminated, so that the degree of freedom in arrangement of thesubstrates can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a diagram showing a light emitting device according to afirst embodiment.

FIG. 1B is a diagram showing a first variation of the first embodiment,in which first substrates and a second substrate are attached to theback surface of a reflecting plate.

FIG. 2 is a schematic plan view of a first substrate in a light emittingdevice according to the first embodiment.

FIG. 3 is a schematic plan view of a second substrate in a lightemitting device according to the first embodiment.

FIG. 4A is a schematic perspective view of a substrate joining structurein a light emitting device according to the first embodiment.

FIG. 4B is a schematic cross-sectional view taken along line X-X in FIG.4A.

FIG. 4C is a diagram showing a shape of a solder member that connects afirst conductive land and a second conductive land.

FIG. 5 is a diagram of light emitting device according to a secondembodiment, showing a schematic cross-sectional view of a state of asubstrate joining structure, in which a first substrate is connected toa second substrate via an adhesive member.

FIG. 6 is a diagram of light emitting device according to a thirdembodiment, showing a schematic perspective view of a state of asubstrate joining structure, in which a long first substrate is added.

FIG. 7 is a diagram showing a light emitting device according to afourth embodiment.

FIG. 8A is a diagram showing an example of a configuration of an openingformed in a surface of a reflecting plate.

FIG. 8B is a diagram showing another example of a configuration ofthrough holes formed in a surface of the reflecting plate.

FIG. 8C is a diagram showing yet another example of a configuration ofthrough holes formed in a surface of the reflecting plate.

FIG. 9A is a schematic plan view showing a portion of a first substrateproximate to a first end of a first substrate used in a light emittingdevice according to a second variation of the first embodiment.

FIG. 9B is a diagram of a substrate joining structure included in alight emitting device according to the second variation of the firstembodiment, showing a schematic plan view of a state of an electricallyconductive joining member covering substantially entire surfaces ofjoining end portion.

DETAILED DESCRIPTION OF EMBODIMENTS First Embodiment

A light emitting device according to a first embodiment will bedescribed. Note that, because the drawings referred to in the followingdescription schematically show the embodiment, the scales, intervals, orpositional relationship of the constituents may be exaggerated, or partof the constituent elements may not be shown. Further, between a planview and a corresponding cross-sectional view, the scale or intervals ofthe constituent elements may not be common. Still further, in thefollowing description, identical names and reference characters denoteidentical or similar constituent elements on principle, and detaileddescriptions are omitted as appropriate.

Configuration of Light Emitting Device

First, a schematic configuration of a light emitting device according toa first embodiment will be described below with reference to FIGS. 1Aand 1B.

FIG. 1A is a diagram showing the light emitting device according to thefirst embodiment. FIG. 1B is a variation of the first embodiment,showing the state where first substrates and a second substrate areattached to the back surface of a reflecting plate. As shown in FIG. 1A,a light emitting device 10 according to the first embodiment includes aplurality of first substrates 2 (component mounting substrates) on whichlight emitting elements 1 such as light emitting diodes (LEDs) aremounted, one second substrate 3 (relay substrate) to which a pluralityof first substrates 2 are connected and coupled, and a reflecting plate4 supporting the first substrates 2 and the second substrate 3. Here,the second substrate 3 and the first substrates 2 are connected to thereflecting plate 4 by an adhesive such as a double-sided adhesive tape.Further, the first substrates 2 are each formed in a long and narrowbelt shape, and are disposed substantially in parallel to each other inthe longitudinal direction. A substrate joining structure included inthe light emitting device according to the first embodiment is astructure to connect the first substrates 2 and the second substrate 3,where the first substrates 2 are long flexible substrates on which thelight emitting elements 1 are mounted.

Further, as shown in FIG. 1B, the light emitting device 10 may be suchthat the first substrate 2 and the second substrate 3 are attached on aback surface of the reflecting plate 4. That is, the light emittingdevice 10 may be configured such that the reflecting plate 4 is attachedto the component mounting surfaces 2 a side of the first substrates 2and to the substrate joining surface 3 a side of the second substrate 3.

In this case, at the reflecting plate 4, through holes 4 h are formedwith respective openings at the positions corresponding to the lightemitting elements 1 mounted on the first substrates 2 so that the lightemitting elements 1 and a joining member (e.g., solder member Hd shownin FIG. 4A) are exposed from the reflecting plate 4. The light emittingdevice 10 may have a configuration in which the first substrates 2 andthe second substrate 3 are attached to (supported by) either the frontsurface side or the back surface side of the reflecting plate 4.

The first substrates 2 and the second substrate 3 may be a copper foilor an aluminum foil in a long and narrow belt shape, coated by aninsulating material. Preferable examples of such an insulating materialinclude polyethylene terephthalate (PET), polyimide, glass epoxy and thelike and it is preferable for such a material to be disposed as a thincoating.

The first substrates 2 and the second substrate 3 may be made ofdifferent materials, but in the case of employing a same material,properties such as the coefficient of linear expansion can be common, sothat distortion at the attached portions due to changes in thetemperature or the like can be reduced.

In the example shown in FIG. 1A, the second substrate 3 is disposed atone surface of the reflecting plate 4, but another configuration thatcan be employed in the light emitting device 10 is one in which thesecond substrate 3, having a plurality of first substrates 2 connectedthereto, is disposed at each of the opposite surfaces of the reflectingplate 4. In this case, the two second substrates 3 may be electricallyconnected either in series or in parallel.

Configuration of First Substrate (Component Mounting Substrate)

FIG. 2 is a plan view of a single first substrate used in a lightemitting device according to the first embodiment. As shown in FIG. 2,the first substrate 2 is a substrate for mounting components such as thelight emitting elements 1. The first substrate 2 is a flexible substratehaving flexibility (pliability). The first substrate 2 is a flexiblesubstrate having a configuration, for example, a flexible first basemember 20 a such as a polyimide base member or a glass epoxy basemember, and component-side conductive portions 20 (first wiringpatterns) each made of an electrically conductive material such as acopper foil, are disposed on the first base member 20 a in a shape ofprinted wiring or the like. The component-side conductive portions 20are wiring portions to which the light emitting elements 1 (mountingcomponents) are electrically connected. The component-side conductiveportions 20 are formed on one surface of the first base member 20 a toprovide a component mounting surface 2 a of the first substrate 2. Onthe component mounting surface 2 a of the first substrate 2, the lightemitting elements 1 are mounted in a row spaced apart from each other ata predetermined interval in the longitudinal direction.

On the component mounting surface 2 a of the first substrate 2, a firstinsulating film 20 b made of an insulating material is disposed. It ispreferable that, with the use of an insulating film 20 b such as a whiteresist having an optical reflectance higher than that of the first basemember 20 a, the light reflectivity of the first substrate can beimproved and thus the brightness of the light emitting device can beimproved. The first insulating film 20 b covers the component mountingsurface 2 a such that portions of the component-side conductive portions20 are exposed at a joining end portion 2 b (see FIG. 4B) near a firstend side (a short side) in the longitudinal direction of the firstsubstrate 2 over the second substrate 3.

At the joining end portion 2 b of the first substrate 2, the first basemember 20 a and the component-side conductive portions 20 are exposedoutside the first insulating film 20 b to soldering. The first wiringpattern may include first conductive lands 21 where the widths of thecomponent-side conductive portions 20 are partially increased near thefirst end at the joining end portion 2 b. With this configuration, asufficient area for soldering can be secured at the first conductivelands 21, so that stronger connection strength can be obtained. In thecase where a sufficient area for soldering can be secured withoutspecifically changing the widths of the component-side conductiveportions 20 near the first end at the joining end portion 2 b, thecomponent-side conductive portions 20 at the joining end portion 2 b canbe used as the first conductive lands 21 without changing the widths.Also, the component-side conductive portions 20 are preferably providedalong the longitudinal direction to the first end (the short side) atthe component mounting surface 2 a of the first substrate 2, but may beprovided onto the joining end portion 2 b.

In the present embodiment, the first conductive lands 21 have asubstantially rectangular shape, but any appropriate shape can beemployed. For example, the first energized lands 21 may each have ashape other than a substantially rectangular shape, such as a circlershape or an elliptical shape.

Further, on the first base member 20 a of the first substrate 2, at thejoining end portion 2 b, first reinforcing lands 22 that areelectrically insulated from the first conductive lands 21 are formed.The first reinforcing lands 22 are also formed at positions electricallyinsulated from the component-side conductive portions 20. For example,the first reinforcing lands 22 are provided at both sides of the joiningend portion 2 b along the longitudinal sides that extend from the firstend (the short side) of the first substrate 2, respectively closer tothe corresponding longitudinal side than the correspondingcomponent-side conductive portion 20 and spaced apart from thecomponent-side conductive portions 20. In the present embodiment, of theouter edges of the first substrate 2 in a plan view, outer edges otherthan the outer edges of the joining end portion 2 b are referred to assecond ends 2 c, as shown in FIG. 2. The first reinforcing lands 22 areregions that allow soldering, and made of, for example an electricallyconductive member such as a copper foil, similarly to the component-sideconductive portions 20. In one example shown in FIG. 2, two firstreinforcing lands 22 are formed on one first substrate 2. An appropriatenumber of first reinforcing lands 22 can be disposed on one firstsubstrate 2. It is preferable that the first reinforcing lands 22 aredisposed so as to reach the corresponding longitudinal sides that areextending from the respective ends of the first end (the short side).

A plurality of light emitting elements 1 are mounted in a row on thecomponent mounting surface 2 a of the first substrate 2 at apredetermined interval. Each light emitting element 1 has electrodes 1a. The electrodes la of each light emitting element 1 are connected tothe component-side conductive portions 20 via, for example, ananisotropic electrically conductive member or solder member. The lightemitting elements 1 of either a same emission color or differentemission colors can be used, and mounted according to the purpose of thelight emitting device 10 (see FIG. 1A).

Configuration of Second Substrate (Relay Substrate)

FIG. 3 is a plan view of the second substrate used in the light emittingdevice according to the first embodiment. As shown in FIG. 3, the secondsubstrate 3 is a substrate for connecting a plurality of firstsubstrates 2. The second substrate 3 is a flexible substrate formedsimilarly to the first substrate 2 shown in FIG. 2, and relay-sideconductive members 30 (second wiring patterns) are formed on an uppersurface of the second base member 30 a by using an electricallyconductive material such as a copper foil. In the first embodiment, theupper surface of the second base member 30 a where the relay-sideconductive members 30 are formed is used as a substrate joining surface3 a of the second substrate 3, and the relay-side conductive members 30are formed on the second substrate 3 at positions corresponding to thecomponent-side conductive portions 20 of the first substrates 2 so as toestablish connection therebetween. Further, a plurality of joiningregions 3 b are formed on the second substrate 3 so that each of thefirst substrates 2 is disposed facing the corresponding second substrate3, and the relay-side conductive members 30 are arranged extending intothe respective joining regions on the second substrate 3. Further, ateach of the joining regions 3 b, second reinforcing lands 32 are formed.Note that, in the second substrate 3, as one example, in the case wherea plurality of first substrates 2 are connected in series, therelay-side conductive members 30 are formed in series.

Further, in the second substrate 3, the substrate joining surface 3 a ismainly coated by a second insulating film 30 b (white resist or thelike) made of an insulating material. It is preferable that, with theuse of an insulating material (such as a white resist) having an opticalreflectance higher than that of the second base member 20 a, the lightreflectivity of the first substrate can be improved and thus thebrightness of the light emitting device can be improved. At the joiningend portion 3 b, the relay-side conductive members 30 and the secondreinforcing lands 32 are exposed outside the second insulating film 30 bto enable soldering. Also, in the joining regions 3 b, end portions ofthe relay-side conductive members 30 are extend in a substantiallyrectangular shape to form the second conductive lands 31 that togetherwith the relay-side conductive members serve as the second wiringpattern. With this arrangement, sufficient areas for soldering can besecured in the second conductive lands 31 and thus, the adhesionstrength at the area can be improved. In the case where the sufficientareas for soldering can be secured without specifically changing thewidth of the end portions of the relay-side conductive portions 30, therelay-side conductive members 30 in the joining regions 3 b can be usedas the second conductive lands 31. In the present embodiment, thejoining regions 3 b are substantially rectangular regions so that thefirst substrate 2 can be overlapped.

The second conductive lands 31 are formed on the joining regions 3 b atpositions that allows soldering to the first conductive land at thejoining end portion 2 b of the first substrate 2 corresponding joiningregions 3 b. In the first embodiment, a plurality of second conductivelands 31 are disposed at predetermined intervals in a straightorientation, and the relay-side conductive members 30 are disposed alsoin a straight orientation to electrically connect the conductive lands31 of adjacent two joining regions 3 b. The relay-side conductivemembers 30 that are connected to a power supply 5 (see FIG. 1A) areelectrically connected to the second conductive lands 31 proximate tothe longitudinal ends portions.

The second conductive lands 31 are formed to have a larger area thanthat of the first conductive lands 21 (see FIG. 2) formed on the firstsubstrate 2. The second conductive lands 31 corresponding to the numberof the first substrates 2 (see FIG. 2) connected to the second substrate3 are formed. For example, in the case where five first substrates 2each having two first conductive lands 21 are connected to the secondsubstrate 3, ten (two for each of the five first substrates 2) of thesecond conductive lands 31, which is the same number as the firstconductive lands 21 that are formed on the first substrate 2, are formedon the second substrate 3.

Further, each joining region 3 b on the second substrate 3 is providedwith the second reinforcing lands 32 formed respectively at positionsthat allow soldering to connect with the corresponding first reinforcinglands 22 that are located at the joining end portion 2 b of the firstsubstrate 2. The second reinforcing lands 32 are arranged on the secondsubstrate 3 so that portions of the second reinforcing lands 32 arearranged substantially in a straight line and across two adjacentjoining regions 3 b, and portions of the second reinforcing lands 32 arespaced apart from each other with respective sides of their longitudinalends being arranged on substantially straight lines. On the second basemember 30 a, the second reinforcing lands 32 are spaced apart from andalso electrically insulated from the second conductive lands 31 and therelay-side conductive members 30 on the second base member 30 a. Thesecond reinforcing lands 32 are region that allow soldering, and in thefirst embodiment, for example, respectively formed in a T-shape. Thesecond reinforcing lands of adjacent two joining regions 3 b may beconnected by a portion of the reinforcing land 32. The secondreinforcing lands 32 are each made of an electrically conductivematerial such as a copper foil, similarly to the relay-side conductivemembers 30.

The second reinforcing lands 32 are formed to be partially exposedoutside the first substrates 2 when the first substrates 2 (see FIG. 2)are overlapped. In the first embodiment, the second reinforcing lands 32respectively include the straight line portions that are substantiallyin parallel to the relay-side conductive members 30, formed to beexposed outside the first substrates 2 when the first substrates 2 areoverlapped.

Configuration of Substrate Joining Structure

FIG. 4A is a schematic perspective view of the substrate joiningstructure in the light emitting device according to the firstembodiment. FIG. 4B is a schematic cross-sectional view taken along lineX-X in FIG. 4A. FIG. 4C is a diagram showing the shape of the soldermember connecting between the first conductive land and the secondconductive land. As shown in FIGS. 4A and 4B, in the substrate joiningstructure in the light emitting device according to the firstembodiment, the first substrates 2 and the second substrate 3 areconnected via a joining member. In the substrate joining structure, thejoining end portion 2 b of each first substrate 2 is overlapped on thecorresponding joining region 3 b of the substrate joining surface 3 a ofthe second substrate 3. Then, in the state where the first substrates 2are overlapped on the second substrate 3 while having their backsurfaces 2 a 1 (the back surfaces of the component mounting surfaces 2a) facing the corresponding joining regions 3 b, the first substrates 2are connected to the second substrate 3 by joining the first conductivelands 21 and the second conductive lands 31 using an electricallyconductive joining member (e.g., the solder member Hd).

In the substrate joining structure, solder member Hd is applied acrossthe first conductive lands 21 (the first wiring patterns) and thecorresponding second conductive lands 31 (the second wiring patterns)respectively so that respective portions of the joining end portion 2 b(the first end portion) are covered by the solder member Hd. Thus, thefirst conductive lands 21 and the second conductive lands 31 aresoldered to each other.

In the case where the first conductive lands 21 are not extended to thedistal ends of the joining end portions 2 b and provided in closeproximity to the distal ends of the joining end portions 2 b, the firstconductive lands 21 are provided at the positions that allow the soldermember Hd to cover a portion of each of the joining end portions 2 b. Inthe case where the first reinforcing lands 22 are not extended to thedistal ends of the first substrates 2 and the first reinforcing lands 22are provided in close proximity to the distal ends, the firstreinforcing lands 22 are provided at the positions that allow the soldermember Hd to cover a portion of each of the end portions.

The two first conductive lands 21 of one first substrate 2 respectivelycorrespond to the electrodes (i.e., the positive electrode and thenegative electrode) of the light emitting element 1, and are joined tothe first conductive lands 21 and the second conductive lands 31 ofcorresponding positive or negative side by solder member Hd. The solderis applied to the first conductive land 21 and the second conductiveland 31 so that short circuit does not occur between the two conductivelands of a single first substrate 2. For example, the solder is appliedso as not to form a solder bridge between the two conductive lands 21provided to one first substrate 2. Thus, the first conductive lands 21and the second conductive lands 31 are soldered respectively.

Further, in the substrate joining structure, the reinforcing-purposejoining member (the solder member Hd in the first embodiment) isdisposed on the respective portions so as to cover at least part of theend portions of each first substrate 2 (the second end portions 2 c thatare different from the first end portion that serves as the joining endportion 2 b) and across the first reinforcing land 22 on the componentmounting surface 2 a of the first substrate 2 and the second reinforcingland 32 on the joining region 3 b of the second substrate 3. Thus, eachof the first reinforcing lands 22 and the corresponding secondreinforcing land 32 is connected to each other. The second conductivelands 31 and the second reinforcing lands 32 of the second substrate 3include the portions positioned outside the first substrates 2 when thefirst substrates 2 are overlaid, so that connection by the solder memberHd can be ensured.

FIG. 9A is a schematic plan view showing a portion of a first substrateproximate to a first end of a first substrate used in a light emittingdevice according to a second variation of the first embodiment. FIG. 9Bis a diagram of a substrate joining structure included in a lightemitting device according to the second variation of the firstembodiment, showing a schematic plan view of a state of an electricallyconductive joining member covering substantially entire upper surfacesof joining end portion. As shown in FIG. 9A, in a plan view, the portionproximate to the first end of the first substrate may have a shape witha recessed portion at the center of the first end side. That is, theportion of the first substrate proximate to the first end has twoextended portions 25. The two first electrically conductive lands 21provided to a single first substrate 2 are respectively formed on thetwo extended portions 25, so that the two first electrically conductivelands 21 are spaced apart from each other. In this case, as shown inFIG. 9B, the two extended portions 25 of the first substraterespectively overlap the second substrate 3, so that the joining endportion 2 b has two separate portions. With this arrangement, even inthe case where the electrically conductive joining member is disposed tocover entire upper surfaces of the two portions of the joining endportion 2 b, the two first electrically conductive lands 21 provided toa single first substrate 2 are not short-circuited with each other.

In the present embodiment, it is preferable that each of the firstsubstrates 2 has the first base member 20 a with a thickness in a rangeof 3 μm to 450 μm, and the copper foil applied as the component-sideconductive portions 20, the first conductive lands 21 and the firstreinforcing lands 22 respectively have a thickness in a range of 15 μmto 40 μm. Further, it is preferable that the first substrates 2 that areflexible substrates respectively have a thickness in a range of 20 μm to500 μm.

For example, the first substrate 2 may have the first base member 20 awith a thickness of about 200 μm, and a copper foil with a thickness ofabout 35 μm as the component-side conductive portions 20 or the likeapplied on each of the opposite surfaces of the first base member 20 a.Such a first substrate 2 has a total thickness of about 270 μm and canbe determined as a standard of the flexible first substrate 2. Further,the first substrate 2 may have the first base member 20 a with athickness of 5 μm, and a copper foil with a thickness of 18 μm as thecomponent-side conductive portions 20 or the like applied on theopposite surface of the first base member 20 a. Such a first substrate 2has a total thickness of 23 μm and can be determined as the flexiblefirst substrate 2 of a smallest thickness. On the other hand, the firstsubstrate 2 may have the first base member 20 a with a thickness of 400μm, and a copper foil with a thickness of about 35 μm as thecomponent-side conductive portions 20 or the like applied on each of theopposite surfaces of the first base member 20 a. Such a first substrate2 has a total thickness of about 470 μm and can be determined as theflexible first substrate 2 of a largest thickness.

With the first substrates 2 having such a thickness, the firstconductive lands 21 and the second conductive lands 31, and the firstreinforcing lands 22 and the second reinforcing lands 32 can beeffectively soldered to each other without cracking the solder memberHd.

Further, the solder member Hd is preferably applied in a shape as shownin FIG. 4C to connect the first conductive land 21 and the secondconductive land 31. As shown in FIG. 4C, the solder member Hd has alongitudinally extending portion 100 and the laterally extending portion101. The longitudinally extending portion 100 is a portion connected tothe first conductive land 21 and extended in the extending direction ofthe first substrate 2. The laterally extending portion 101 is a portionconnected to the second conductive land 31 and extended in the extendingdirection of the second substrate 3. In the shape of the solder memberHd, for the sake of convenience, the extending direction of the firstsubstrate 2 is referred to as the longitudinal direction Hy, and theextending direction of the second substrate 3 is referred to as thelateral direction Hx.

In this case, the solder member Hd preferably has a longitudinallyextending portion 100 with a lateral length h×1 in a range of 0.5 mm to3.0 mm, and a laterally extending portion 101 with a lateral length h×2in a range of 0.5 mm to 5.0 mm. It is also preferable that thelongitudinal portion has a longitudinal length hy1 in a range of 0.5 mmto 5.0 mm and the laterally extending portion 101 has a longitudinaldirection hy2 in a range of 0.5 mm to 5.0 mm.

In the case of the solder member Hd having the longitudinally extendingportion 100 and the laterally extending portion 101 with a dimension ordimensions (i.e., the length in the longitudinal direction and/or thelateral direction) greater than that described above, cracks tend tooccur in the solder member Hd. In the case of the solder member Hdhaving the longitudinally extending portion 100 and the laterallyextending portion 101 with a dimension or dimensions (i.e., the lengthin the longitudinal direction and/or the lateral direction) smaller thanthat described above, handleability may decrease. In order to preventthe solder member Hd from cracking and maintain handleability, thelongitudinally extending portion 100 and the laterally extending portion101 of the solder member Hd preferably have dimensions (i.e., the lengthin the longitudinal direction and/or the length in the lateraldirection) in the range discussed above.

In the substrate joining structure, the first base member 20 a isbetween the component-side conductive portions 20 provided at thecomponent mounting surface 2 a of each first substrate 2 and therelay-side conductive members 30 provided at the substrate joiningsurface 3 a of the second substrate 3. Also, in the substrate joiningstructure, the joining end portion 2 b of the first substrate 2 isoverlapped on the joining region 3 b of the second substrate 3 andconnected thereto such that the component-side conductive portions 21and the relay-side conductive member 31 are not connected facing eachother. Note that, in the present embodiment, the entire first substrate2 is disposed such that all the portions except for the joining endportion 2 b do not overlap the second substrate 3.

In the substrate joining structure, the second insulating film 30 b isinterposed between the first base member 20 a of each first substrate 2and the second base member 30 a of the second substrate 3. But, thefirst substrate 2 and the second substrate 3 (the second base member 30a) may be brought into contact (surface contact) with each other havingnone of other members such as the second insulating film 30 binterposed. That is, the second insulating film 30 b may not be providedto the portion of the second substrate 3 where the first substrate 2overlaps (i.e., the joining region 3 b). In this case, the thickness ofthe connecting portion of the first substrate 2 and the second substrate3 can be reduced.

Note that, in the case where the reinforcing joining member thatconnects the first reinforcing land 22 and the second reinforcing land32 is the solder member Hd, the first reinforcing land 22 and the secondreinforcing land 32 can be connected in the same operation of connectingthe first conductive land 21 and the second conductive land 31 by thesolder member Hd, so that the work efficiency of connecting the firstsubstrates 2 and the second substrate 3 can be improved. Further, forthe reinforcing joining member, an appropriate member other than thesolder member Hd can be also used. For example, an electricallyconductive adhesive agent may be used in connecting the firstreinforcing land 22 and the second reinforcing land 32. For thereinforcing joining member to connect the first reinforcing land 22 andthe second reinforcing land 32, a non-electroconductive material canalso be used.

As described above, according to the first embodiment, the firstsubstrates 2 and the second substrate 3 can be connected to each otherwithout the necessity of using joining components such as a connector.That is, the substrate joining structure in the light emitting deviceaccording to the first embodiment can serve equivalently as a structurein which the first substrate 2 and the second substrate 3 are connectedto each other with the use of a joining component such as a connectors,it does not require the joining components such as connectors, and thecosts relating to the joining components such as connectors can beeliminated. Further, since the space in which the joining componentssuch as connectors are disposed is not required, the flexibility indisposing the first substrates 2 and the second substrate 3 (thesubstrate layout) improves.

Further, with the substrate joining structure included in the lightemitting device according to the first embodiment, the first reinforcinglands 22 on the component mounting surface 2 a of each first substrate 2and the second reinforcing lands 32 on the substrate joining surface 3 aof the second substrate 3 are connected by the reinforcing-purposejoining member. Accordingly, with the substrate joining structureaccording to the first embodiment, the first substrates 2 and the secondsubstrate 3 are firmly connected to each other, and the joining strengthbetween the first substrates 2 and the second substrate 3 improves.

Still further, with the substrate joining structure according to thefirst embodiment, the first substrates 2 overlaps the second substrate 3such that the component-side conductive portions 20 provided at thefirst base member 20 a of each first substrate 2 and the relay-sideconductive members 30 provided at the second base member 30 a of thesecond substrate 3 do not oppose to each other. Accordingly, as shown inFIG. 4A, the first conductive lands 21 and the second conductive lands31 are oriented in the same direction. Therefore, the work of dispensingthe solder member Hd across the first conductive lands 21 and theircorresponding second conductive lands 31 can be facilitated. Similarly,the first reinforcing lands 22 and the second reinforcing lands 32 areoriented in the same direction, so that the work of dispensing thesolder member Hd across the first reinforcing lands 22 and the secondreinforcing lands 32 can be facilitated.

In the substrate joining structure used in the light emitting deviceaccording to the first embodiment, the first reinforcing lands 22 areformed on the first substrates 2, and the second reinforcing lands 32are formed on the second substrate 3. But, the substrate joiningstructure may be formed without the first reinforcing lands 22 and thesecond reinforcing lands 32. In this case, the first substrate 2 and thesecond substrate 3 are connected to each other at the first conductivelands 21 and the second conductive lands 31, respectively.

Second Embodiment

FIG. 5 is a diagram of a substrate joining structure in a light emittingdevice according to a second embodiment, showing a schematiccross-sectional view of a state where the first substrate is adhered tothe second substrate via an adhesive member. Note that, in thedescription of the second embodiment, constituent components that arethe same or similar to those of the substrate joining structure includedin the light emitting device according to the first embodiment aredenoted by the same reference numerals, and detailed descriptionsthereof will be omitted.

In the first embodiment, as shown in FIG. 4B, the joining end portion 2b of the first substrate 2 is arranged overlapping the substrate joiningsurface 3 a of the second substrate 3. At this time, the first substrate2 and the second substrate 3 overlap with each other, with the backsurface 2 a 1 of the first substrate 2 overlapping the substrate joiningsurface 3 a. As a substrate joining structure included in the secondembodiment, as shown in FIG. 5, the first substrate 2 may overlap thesecond substrate 3 (the substrate joining surface 3 a) via an adhesivemember 6 such as a double-sided tape. That is, the substrate joiningstructure may be such that, the back surface 2 a 1 of the first basemember 20 a of the first substrate 2 overlaps the substrate joiningsurface 3 a of the second base member 30 a of the second substrate 3 viathe adhesive member 6 such as a double-sided tape, and thus the firstsubstrate 2 and the second substrate 3 are adhered to each other by theadhesive member 6. In this case, the first substrate 2 and the secondsubstrate 3 are fixed to each other also by the adhesive member 6 inaddition to the solder, the first substrate 2 and the second substrate 3can be more firmly connected to each other, and the connection strengthbetween the first substrates 2 and the second substrate 3 can beenhanced. Note that, an appropriate adhesive member 6 other than thedouble-sided tape can also be used. An adhesive agent may be used as theadhesive member 6.

Moreover, at the portion where the first substrate 2 overlaps the secondsubstrate 3, an adhesive agent may be applied along the end portion ofthe second substrate 3. That is, the back surface 2 a 1 of the firstsubstrate 2 and the end portion of the second substrate 3 may be fixedto each other and reinforced by an adhesive agent. Further, at theportion where the first substrate 2 overlaps the second substrate 3, acover tape may be attached across the end portion of the secondsubstrate 3 and the back surface 2 a 1 of the first substrate 2. Thatis, the back surface 2 a 1 of the first substrate 2 and the end portionof the second substrate 3 may be fixed to each other and reinforced by acover tape.

The substrate joining structure included in the light emitting deviceaccording to the second embodiment may not include the first reinforcinglands 22 and the second reinforcing lands 32. Even with this structure,the first substrate 2 and the second substrate 3 are firmly fixed toeach other by the adhesive member 6.

Third Embodiment

FIG. 6 is a diagram of a light emitting device according to a thirdembodiment, showing a schematic perspective view of a state of asubstrate joining structure, in which a long first substrate is added.Note that, in the description of the third embodiment, constituentcomponents that are the same or similar to those of the substratejoining structure according to the first embodiment are denoted by thesame reference numerals, and detailed descriptions thereof will beomitted. As shown in FIG. 6, as the third embodiment, the firstsubstrates 2 can be connected to each other by the substrate joiningstructure. That is, the first substrate 2 can be additionally connectedto the first substrate 2 with the use of the substrate joining structureaccording to the third embodiment. In this case, the first substrate 2(the component mounting substrate) and another first substrate 2 (thecomponent mounting substrate) are connected to each other. It is alsopossible that a joining end portion 2 b and first conductive lands 21and first reinforcing lands 22 are newly provided to either end of twoconnected first substrates 2, and then connected to the second substrate3. That is, as shown in FIG. 6, a joining end portion 2 b is formed bythe longitudinal end portions of two first substrates 2, and the firstconductive lands 21 are formed near the joining end portion 2 b on eachof the component mounting surfaces 2 a. Then, the joining end portion 2b of one first substrate 2 is placed overlapping the joining end portion2 b of the other first substrate 2, and the corresponding firstconductive lands 21 of the two first substrates 2 are soldered andconnected. In the case where the first reinforcing lands 22 are formedon both of the two first substrates 2, soldering the corresponding firstreinforcing lands 22 of the two first substrates 2 and the firstreinforcing lands 22 of the other first substrate 2 to connect eachother allows for enforcing the connection strength in the case ofadditionally connecting the first substrate 2.

Fourth Embodiment

FIG. 7 is a diagram showing a light emitting device according to afourth embodiment. A light emitting device 10 a according to the fourthembodiment includes a configuration to reduce warpage caused by, forexample, heat. As shown in FIG. 7, the reflecting plate 4 of the lightemitting device 10 a according to the fourth embodiment is provided withrows of small slits 4 a that can reduce warpage of the reflecting plate4 caused by heat. Note that, the light emitting device 10 a according tothe fourth embodiment is different from the light emitting device 10according to the first to third embodiments (see FIG. 1A) in that rowsof small slits 4 a are formed in the reflecting plate 4, and otherconfigurations are similar to that of the light emitting device 10 shownin FIG. 1A. Thus, detailed description other than the rows of smallslits 4 a will be omitted.

One row of small slits 4 a in the reflecting plate 4 is formed in aperpendicular direction with respect to the longitudinal direction ofthe first substrate 2 so that the holes are spaced apart from oneanother and penetrating the reflecting plater 4. Further, one row ofsmall slits 4 a is formed across the reflecting plate 4 from one end tothe other. The rows of small slits 4 a are formed at appropriatelocations (i.e., between the light emitting elements 1) to avoid thelight emitting elements 1 mounted on the first substrates 2. The rows ofsmall slits 4 a are preferably formed corresponding to intermediatelocations between each adjacent two light emitting elements 1 on onefirst substrate 2 so that the light emitting elements 1 are not mountedabove any slits 4 a. It is also preferable that plural of the smallslits 4 a are formed corresponding to the locations between adjacent twolight emitting elements 1 on one first substrate 2, which is assumed toenhance effect of thermal separation through the slits 4 a. Further, inthe fourth embodiment, the rows of small slits 4 a are preferably formedin parallel to each other, so that ease can be provided to arrange thelight emitting elements 1 mounted on the respective first substrates 2at nearly uniform relative distances to the corresponding rows of smallslits 4 a. Further, the rows of small slits 4 a are preferably formedsubstantially in parallel or perpendicular with respect to thecorresponding sides of the reflecting plate 4, so that ease can beprovided to arrange the light emitting elements 1 mounted on therespective substrates 4 at nearly uniform relative distances to thecorresponding rows of small slits 4 a or to the corresponding sides ofthe reflecting plate 4. For example, the rows of small slits 4 a mayextend at predetermined angles (e.g., 45°) relative to the sides of thereflecting plate 4. The rows of small slits 4 a may be formed in ahoneycomb pattern. That is, the reflecting plate 4 may be provided withthe rows of small slits 4 a arranged in a plurality of adjacenthexagons. Also, the rows of small slits 4 a may be formed in straightline shapes or in any other appropriate shapes such as in curved lineshapes such as circular shapes or arc shapes, or in a combination ofstraight lines and curved lines.

Note that, the rows of small slits 4 a are preferably provided at thepositions avoiding the light emitting elements 1 mounted on the firstsubstrates 1. That is, the rows of small slits 4 a are preferablyprovided so as not to cross the positions where the light emittingelements 1 are disposed.

In each rows of small slits 4 a, the interval of the adjacent smallholes, and the length and width of each hole can be appropriatelyarranged according to the strength required for the light emittingdevice 10 (the reflecting plate 4), and within a range where insulationof the first substrates 2 can be secured. The number of holes in eachrow of small slits 4 a can be determined as appropriate. Also, the rowsof small slits 4 a may be substantially the same size or may bedifferent in different rows. Further, in the case where a plurality ofrows of small slits 4 a are formed, the distance between two adjacentrows of small slits 4 a may be the same or different.

For example, in the case of using the reflecting plate 4 made of PET andthe first substrates 2 having the base member made of polyimide, thereflecting plate 4 has a thermal expansion coefficient greater than thatof the first substrates 2. Accordingly, when heat generated by a drivingcircuit or the like is applied on the light emitting device 10 (FIG. 1A)according to the first embodiment that includes the reflecting plate 4absence of the rows of small slits 4 a, dimensional changes occurdifferently in the reflecting plate 4 and the first substrates 2, whichmay result in warpage of the light emitting device 10. Meanwhile asshown in FIG. 7, when the heat is applied to the reflecting plate 4provided with the rows of small slits 4 a, the reflecting plater 4expands widening the holes 4 a, so that overall dimensional change ofthe reflecting plate 4 can be reduced, and thus, occurrence of warpagein the light emitting device 10 a can be reduced. In the case of aconfiguration absence of the rows of small slits 4 a, when the heat isapplied, the temperature of the reflecting plate 4 at the side that isprovided with a plurality of the light emitting elements 1 becomeshigher than that of the opposite side, so that there is a tendency ofoccurrence of upward warpage of the reflecting plate 4 as a whole, withthe side of the reflecting plate 4 having the light emitting elements 1warped upward. Meanwhile, it is thought that with the rows of smallslits 4 a, the reflecting plate 4 can be thermally divided into smallerunits, so that overall warpage can be reduced. As described above, theportions of the reflecting plate 4 with the rows of small slits 4 a tendto have larger degree of extension-contraction and warpage than otherportions caused by repetitive ON-OFF operation of the light emittingdevice. Accordingly, providing the rows of small slits 4 a to avoid thelocations corresponding to the locations of the light emitting devices 1mounted on the first substrate allows for a reduction in occurrence ofdetachment of the light emitting devices 1 from the component-sideconductive portions 20. With the light emitting device 10 a according tothe fourth embodiment, even when the light emitting device 10 a isplaced at high-temperature and high-humidity places, or heated or dried,a warp can be effectively suppressed.

Fifth Embodiment

FIG. 8A is a diagram showing a through hole defined in a surface of thereflecting plate. FIG. 8B is a diagram showing other form of the throughholes defined in a surface of the reflecting plate. FIG. 8C is a diagramshowing another form of the through holes defined in a surface of thereflecting plate. As shown in FIG. 1A, during the production of thelight emitting device 10 in which the first substrates 2 and the secondsubstrate 3 are disposed on the reflecting plate 4, in the case ofconnecting the first conductive lands 21 (see FIG. 4A) and thecorresponding second conductive lands 31 (see FIG. 4A), respectively, byusing solder member Hd (see FIG. 4A), the connecting portions mayexperience extremely high temperature. Also, in the case of connectingthe first reinforcing lands 22 (see FIG. 4A) and the correspondingsecond reinforcing lands 32 (see FIG. 4A), respectively by using soldermember Hd (see FIG. 4A), the connecting portions may also experienceextremely high temperature.

Meanwhile, the reflecting plate 4 made of a resin material such as PETtends to melt at a high temperature. Such melting of the reflectingplate 4 by a high-temperature may generate fragments of the resin thatadhere to the surface 4 f of the reflecting plate 4 shown in FIG. 8A.The surface 4 f of the reflecting plate 4 is to reflect the light fromthe light emitting element 1 (see FIG. 4A), so that adhesion of thefragments of the resin to the surface 4 f of the reflecting plate 4 maylead a reduction in the light emitting performance of the light emittingdevice 10.

As shown in FIG. 8A, with the through hole 4 h defined in the reflectingplate 4 at a location corresponding to the solder member Hd (thepositions of the first conductive lands 21 and the second conductivelands 31 and the positions of the first reinforcing lands 22 and thesecond reinforcing lands 32 shown in FIG. 4A), while avoiding exposureof whole portion of the second substrate 3 from the through hole 4 h,contact between the solder member Hd that may reach a high temperaturesand the reflecting plate 4 can be avoided. Thus, melting of thereflecting plate 4 and resulting generation of fragments of the resincan be avoided. Accordingly, even in the light emitting device 10 thatemploys a configuration of having the first substrates 2 and the secondsubstrate 3 disposed on the reflecting plate 4, the first substrates 2and the second substrate 3 can be connected to each other by the soldermember Hd without reducing the light emitting characteristics.

Note that, in the present embodiment, substantially rectangular throughhole 4 h is defined in the reflecting plate 4, but the through hole 4 hcan be formed with any appropriate shape and size. For example, as shownin FIG. 8A, one large through hole 4 h may be defined so as to exposeall the solder members Hd. Meanwhile, as shown in FIG. 8B, a pluralityof through holes 4 h may be defined in the reflecting plate 4 a atlocations corresponding to each single first substrate 2, such that onethrough hole 4 h is defined to expose all the solder members Hd providedto a single first substrate 2. Also, as shown in FIG. 8C, one throughhole 4 h may be defined corresponding to each one of the solder membersHd. For example, four through holes 4 h may be formed corresponding tofour solder members Hd provided to a single first substrate 2. That is,it is preferable that each through hole 4 h is defined corresponding tothe location of each solder member Hd or to a location surrounding oneor more solder members Hd, so that the influence of heat from the soldermembers Hd on the reflecting plate and be reduced and contact betweenthe reflecting plate 4 and the solder members Hd can be avoided.

Note that, the configuration of the substrate joining structure includedin the light emitting device according to the first to fifth embodimentscan be changed as appropriate. For example, in the first embodiment asshown in FIG. 1A, the first substrates 2 connected to the secondsubstrate 3 respectively haven a long rectangular shape (a belt shape).But the first substrates 2 that are connected to the second substrate 3may have any appropriate shapes. With the use of the substrate joiningstructure according to the first embodiment and the substrate joiningstructure according to the second embodiment, the first substrates ofvarious shapes such as a substantially rectangular shape (including asubstantially square shape) or a substantially circular shape (includinga substantially elliptical shape) can be connected to the secondsubstrate 3.

Also, the substrate joining structure used in the light emitting deviceaccording to the first embodiment and/or the second embodiment can beused to connect a flexible substrate and a rigid substrate (i.e., asubstrate made of a base material having a high rigidity). In this case,the flexible substrate can be connected to the rigid substrate byoverlapping the flexible substrate on the rigid substrate and solderingfrom the flexible substrate side.

Also, the first substrates 2 may be a multilayer substrate (a substratein which the first base member 20 a includes layers of thecomponent-side conductive portions 20 stacked in the first base member20 a), and/or the second substrate 3 may be a multilayer substrate (asubstrate made of multilayers of a relay-side conductive member 30 arestacked each as a layer inside the second base member 30 a). In the casewhere the first substrate 3 is a multilayer substrate, the firstconductive lands 21 and the first reinforcing lands 22 are exposed atthe component mounting surface 2 a. In the case where the secondsubstrate 3 is a multilayered substrate, the second conductive lands 31and the second reinforcing lands 32 are exposed at the substrate joiningsurface 3 a.

The electrically conductive joining member other than solder member Hdcan be used as appropriate. For example, an electrically conductiveadhesive agent may be used to connect (adhere) the first conductivelands 21 and the second conductive lands 31.

Also, the electronic components mounted on the first substrates 2 (seeFIG. 1A) are not limited to the light emitting elements 1 (see FIG. 1A).For example, as the mounted electronic components, other electroniccomponents such as transistors, resistors, capacitors, Zener diodes,bridge diodes, and fuses may be provided additionally to the lightemitting element 1, or such other electronic components solely may beprovided.

Further, each embodiment may include a configuration in which thesubstrate joining structure does not include the first reinforcing lands22 (see FIG. 4A) and the second reinforcing lands 32 (see FIG. 4A).

Although the foregoing refers to particular preferred embodiments, itwill be understood that the disclosure is not so limited. Variousmodifications may be made to the disclosed embodiments and that suchmodifications are intended to be within the scope of the disclosure. Allof the publications, patent applications and patents cited herein areincorporated herein by reference in their entirety.

What is claimed is:
 1. A light emitting device comprising: a firstsubstrate comprising: a flexible first base member, and a first wiringpattern provided on the first base member, the first wiring patterncomprising: a first conductive land, a first component-side conductiveportion extending from the first conductive land, a second conductiveland, and a second component-side conductive portion extending from thesecond conductive land; a second substrate comprising: a second basemember, and a second wiring pattern provided on the second base member,the second wiring pattern comprising: a first conductive land, and asecond conductive land; a plurality of light emitting elements mountedon the first substrate, each light emitting element being electricallyconnected to the first component-side conductive portion and the secondcomponent-side conductive portion; a first electrically conductivejoining member that is disposed across and contacts the first conductiveland of the first wiring pattern and the first conductive land of thesecond wiring pattern; a second electrically conductive joining memberthat is disposed across and contacts the second conductive land of thefirst wiring pattern and the second conductive land of the second wiringpattern; wherein the first substrate includes: a joining end portionthat is located at a first, joining end of the first substrate, and thatoverlaps a portion of the second substrate, and a second end, other thanthe joining end, that does not overlap the second substrate, wherein thefirst wiring pattern and the second wiring pattern do not face eachother, wherein a portion of the first wiring pattern is located at oradjacent to the joining end portion.
 2. The light emitting deviceaccording to claim 1, wherein the first wiring pattern extends to thefirst end of the first substrate.
 3. The light emitting device accordingto claim 1, further comprising a first insulating film disposed on thefirst substrate, a light reflectance of the first insulating film beinghigher than a light reflectance of the first substrate.
 4. The lightemitting device according to claim 1, further comprising: a firstreinforcing land that is electrically insulated from the first wiringpattern and that is formed on the first base member, a secondreinforcing land that is electrically insulated from the second wiringpattern and that is formed on the second base member, and a reinforcingjoining member that is disposed across the first reinforcing land andthe second reinforcing land, while partially covering the joining endportion of the first substrate.
 5. The light emitting device accordingto claim 1, wherein the first base member and the second base member arebonded to each other by an adhesive member.
 6. The light emitting deviceaccording to claim 1, wherein the second substrate is a flexiblesubstrate.
 7. The light emitting device according to claim 1, whereinthe first and second electrically conductive joining members are soldermembers.
 8. The light emitting device according to claim 4, wherein thereinforcing joining member is a solder member.
 9. The light emittingdevice according to claim 1, wherein the first substrate has a thicknessin a range of 20 μm to 500 μm.
 10. The light emitting device accordingto claim 1, wherein the first substrate and the second substrate areattached to a reflecting plate.
 11. The light emitting device accordingto claim 10, wherein the reflecting plate is attached to the firstwiring pattern side of the first substrate and defines through holes atpositions corresponding to the first and second electrically conductivejoining members.
 12. The light emitting device according to claim 4further comprising a reflecting plate attached to the first wiringpattern side of the first substrate, wherein the reflecting platedefines a through hole at a position corresponding to the reinforcingjoining member.
 13. The light emitting device according to claim 4further comprising a reflecting plate attached to the first wiringpattern side of the first substrate, wherein the reflecting platedefines through holes at positions corresponding to the first and secondelectrically conductive joining members and the reinforcing joiningmember.
 14. The light emitting device according to claim 10, wherein atleast one row of small slits is defined in the reflecting plate.
 15. Thelight emitting device according to claim 14, wherein the at least onerow of small slits is located so as not to cross a location of the lightemitting elements.
 16. The light emitting device according to claim 1,wherein the joining end portion overlaps the second wiring pattern. 17.The light emitting device according to claim 1, wherein: the joining endportion comprises a first extended portion and a second extended portionthat are separated from each other by a recessed portion, the firstconductive land of the first substrate is a part of the first extendedportion, and the second conductive land of the first substrate is a partof the second extended portion.
 18. The light emitting device accordingto claim 1, wherein the first substrate is elongated such that a lengthof the first substrate is larger than a width of the first substrate.19. The light emitting device according to claim 18, wherein: in a widthdirection of the first substrate, a width of the first component-sideconductive portion is less than a width of the first conductive land,and a width of the second component-side conductive portion is less thana width of the second conductive land, the first component-sideconductive portion extends in a straight line along a length directionof the first substrate from the first conductive land, and the secondcomponent-side conductive portion extends in a straight line along thelength direction of the first substrate from the second conductive land.20. The light emitting device according to claim 1, wherein: the secondwiring pattern further comprises: a first relay-side conductive portionthat electrically connects the first conductive land to a thirdconductive land, and a second relay-side conductive portion thatelectrically connects the second conductive land to a fourth conductiveland.
 21. The light emitting device according to claim 20, wherein adirection in which the first-relay side conductive portion and thesecond relay-side conductive portion extend is perpendicular to adirection in which the first component-side conductive portion and thesecond component-side conductive portion extend.